SG debt listings Friday: TSMC Arizona, Taixing Jinjiang Investment, Liangshan Devt

An electronic motherboard. Photo by Harrison Broadbent on UnsplashAn electronic motherboard. Photo by Harrison Broadbent on Unsplash

These are entities which announced debt listing confirmations in Singapore on Friday, 22 April 2022: TSMC Arizona Corp., Taixing Jinjiang Investment Co. and Liangshan Development (Holdings).

TSMC Arizona

TSMC Arizona said Friday its US$1 billion 4.50 percent notes due 2052 (ISIN code: US872898AJ06) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the chipmaker said in a filing to SGX.

TSMC Arizona is a subsidiary of Taiwanese chipmaker TSMC; construction of TSMC Arizona’s planned 12-inch wafer foundry in Arizona, United States, began in mid-2021. In February 2022, Nikkei Asia reported, citing sources, the construction was three to six months being schedule.

TSMC Arizona

TSMC Arizona said Friday its US$1 billion 4.25 percent notes due 2032 (ISIN code: US872898AH40) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the chipmaker said in a filing to SGX.

TSMC Arizona is a subsidiary of Taiwanese chipmaker TSMC; construction of TSMC Arizona’s planned 12-inch wafer foundry in Arizona, United States, began in mid-2021. In February 2022, Nikkei Asia reported, citing sources, the construction was three to six months being schedule.

TSMC Arizona

TSMC Arizona said Friday its US$1 billion 3.875 percent notes due 2027 (ISIN code: US872898AF83) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the chipmaker said in a filing to SGX.

TSMC Arizona is a subsidiary of Taiwanese chipmaker TSMC; construction of TSMC Arizona’s planned 12-inch wafer foundry in Arizona, United States, began in mid-2021. In February 2022, Nikkei Asia reported, citing sources, the construction was three to six months being schedule.

TSMC Arizona

TSMC Arizona said Friday its US$500 million 4.125 percent notes due 2029 (ISIN code: US872898AG66) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the chipmaker said in a filing to SGX.

TSMC Arizona is a subsidiary of Taiwanese chipmaker TSMC; construction of TSMC Arizona’s planned 12-inch wafer foundry in Arizona, United States, began in mid-2021. In February 2022, Nikkei Asia reported, citing sources, the construction was three to six months being schedule.

Liangshan Development (Holdings)

Liangshan Development (Holdings) said Friday its US$204 million 6.5 percent notes due 2025 (ISIN code: XS2470873626) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the entity said in a filing to SGX.

China-based Liangshan Development (Holdings), or LSID, is Liangshan prefecture’s investment and financing platform; it manages state-owned assets such as mineral products and hydroelectricity, as well as public-welfare projects such as roads, schools and other infrastructure projects, according to Fitch Ratings.

Taixing Jinjiang Investment Co.

Taixing Jinjiang Investment Co. said Friday its US$30 million 3.5 percent credit-enhanced bonds due 2025 (ISIN code: XS2459125527) would be listed on SGX’s bond market on Monday.

The notes, which will trade in U.S. dollars, will be in denomination of US$200,000, which is also the minimum board lot size, the company said in a filing to SGX.

Taixing Jinjiang Investment is a China-based special purpose vehicle (SPV) listed as being involved in finance and insurance.